发布时间:2018-11-22 06:34:33

With the development of science and technology, the electronic industry has made rapid progress, the demand for various integrated and control circuits has increased rapidly, and the demand for chip packaging has also increased rapidly.

 

 

 

Chip packaging refers to the installation of precise semiconductor integrated circuit chips on the frame, then connecting the chip with the frame pins by lead, and finally sealing the semiconductor integrated circuit chips with epoxy resin. The external signal is transmitted through pins and internal chips. Packaging is mainly to seal the precise semiconductor integrated circuit chips, so that the semiconductor integrated circuit chips play a role, while not affected by external humidity and dust, while providing good anti-mechanical vibration or shock protection, improve the applicability of semiconductor integrated circuit chips.

 

 

 

Installation, as an important part of chip packaging, uses binder or lead-tin solder to preliminarily fix small semiconductor integrated circuit chips to the frame bearing seat, providing support for subsequent lead welding and sealing.

 

 

 

When the small and precise chip is removed from the wafer and enlarged on the bearing seat, it must rely on the special suction nozzle for chip loading. The improper control of this link in the conventional operation will easily cause the failure of chip loading, which will affect the final product yield.